In laser materials processing, it is important, e.g., to synchronize the movements of the workpiece, laser, and laser scanner in order to utilize the potential of modern laser sources and be able to cut thin glass panes at a high throughput without the need for any reworking or drill the smallest vias, for example. To ensure reliable quality assurance processes, components or test equipment must be moved precisely and with a high degree of repeatability.
Dosing in the microliter or even nanoliter range is required for the precise connection of electronic components or to create complex microstructures in additive production processes such as direct ink writing (DIW).
Numerous highly automated technologies also require solutions that enable the contactless monitoring of processes, machines, and systems in order to guarantee the quality and throughput of products.
A wide range of technologies, many years of experience in precision positioning and piezo technology, and a modular approach enable PI to respond to the specific requirements of each application, support customers around the world, and achieve the required level of performance for the process or machine: From single components through to complex multi-axis solutions, including their control systems and application software.