Many SiPh device manufacturers strategize their production by leveraging the expertise and resources of Outsourced Semiconductor Assembly and Test (OSAT) enterprises and specialized contract manufacturers.
For example, Integra Technologies is a fast-turnaround Silicon Valley fixture with capabilities across a wide range of chip test and packaging processes, including DMEA Accredited Category 1A Trusted applications involving highly sensitive tasks, and with facilities in Albuquerque and Wichita. Early in the Silicon Photonics saga, they pioneered custom SiPh change-kits: briefcase-sized personalization modules that accommodate each chip design’s I/O configuration within a multi-purpose high-speed tester tool, allowing one tool to be used for many types of chips. These bespoke photonic change-kits integrated PI’s FMPA fast photonic scan/align technology to accommodate high-speed validation of SiPh chips in various stages of assembly. At the time, the industry’s focus was on high-speed networking interconnect technologies for data centers. But as SiPh has broadened into consumer and other non-datacom applications, Integra-Tech kept pace. Recently, Integra-Tech branched out into contract assembly, implementing new cleanroom integration capabilities for exploring, developing, and scaling process approaches (https://www.integra-tech.com/blog/integra-technologies-expands-silicon-photonics-capabilities). Their first packaging venture involved just such a non-datacom chip: a phased array device similar to that described some years ago (https://www.researchgate.net/publication/304536829_Highly_integrated_optical_phased_arrays_Photonic_integrated_circuits_for_optical_beam_shaping_and_beam_steering) for shaping and laser beams steering for communications and LIDAR.
Benchmark Electronics has extensive capability in process-engineering and assembly of fiber optic and SiPh devices, including highly differentiating expertise in Liquid Crystal Polymer substrates (https://www.bench.com/photonics). This bleeding-edge substrate technology enables especially space-efficient designs with physical robustness and extraordinary speeds exceeding 110GHz. Benchmark's optical and photonic capabilities include a spectrum of manufacturing proficiency benefiting photonic integrated circuit packaging, termination, and hybrid module assembly. Their experience spans transceivers, pumps, tunable and fiber lasers, DWDM, OADM, router, line cards, and switches.With some of the biggest names in the field relying on Benchmark’s new Phoenix, Arizona RF and High Speed Design Center of Innovation for design and packaging services, Benchmark has recently developed an advanced, FMPA-based photonics automation architecture to continue its edge in productivity and quality. The new proprietary platform leverages the parallelism and industrial-class submicron motion qualities of PI’s architecture, ensuring extensibility and quick-response customization— essential capabilities for the rapidly-evolving photonics device market.